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        full-format

        Full-Format Printing

        Reduce thermal deformation and shrinkage of the model during the printing process, avoiding warping to achieve large-format (305 x 260 x 260 mm) printing.

        pc-printing

        PC Printing

        Heated chamber at 100°C prevents warping, delamination, and deformation in long-edge PC prints over 150 mm.

        mech-prop

        Superior Mechanical Properties

        High-temperature semi-crystalline structures provide enhanced strength and toughness.
        Consistent chamber temperatures ensure consistent mechanical performance.

        Super High-Speed Printing with FUNMAT PRO 310 NEO 3D Printer!

        • Offers 8 high-speed material processing options, achieving a productivity range of 500-1000g/day
        • Doubles capacity for duplicate and mirror mode, reaching 1kg/day.
        • Maintains perfect control over print quality and precision at high speeds, delivering reliable continuous production to meet industrial application demands.

        Printing Volume

        Single – 305 x 260 x 260mm (12.0 x 10.2 x 10.2″)

        Dual – 260 x 260 x 260mm (10.2 x 10.2 x 10.2″)

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        Next-Generation Print Mainboard, Driving High-Speed Printing Innovation

        Powered by NXP’s advanced MCU, this mainboard provides the robust computing power needed for high-speed printing.

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        Perfect Surface Finish with Advanced Motion Control Algorithms

        Intelligent Speed Prediction: Predicts printing speeds based on path complexity to maintain exceptional surface quality even with intricate feature structures.

        Flow Compensation Technology: Dynamically adjusts the material extrusion rate to prevent surface defects during high-speed printing.

        MATERIAL VERSATILITY FOR INDUSTRIAL APPLICATIONS

        Start printing in various Engineering materials (PPA-CF/GF, PC, PC-FR, PC/PBT, ABS-HS, PA12-CF, PC/ABS, ABS+, PA6/66, PA6-CF), High-Performance Materials (PPS, PPS-CF/GF), Flexible Materials (TPU95A) and Basic Material PLA.

        Request Pricing or Talk to a 3D Printing Expert

        OPEN-SOURCE MATERIAL SYSTEM

        Independent Filament Box

         

        Overall sealed design with molecular sieve dehumidification, built-in temperature and humidity monitoring sensor.

        Independent design, easy to place and maintain

        Design of active fixing for spools, prevent the filaments from being loose and knotted

        Spool capacity: 2*1kg